What is ACF Bonding?
ACF Bonding is the most important fabrication technique used in electronics. The process used a thin film of adhesive to connect the components and screens. The technique has virtually replaced all other types of connection and interconnection techniques. In many respects, ACF Bonding is the best connection techniques used in microelectronics industry.
An important thing to remember about the popularity of the technique is that it replaces lead base soldering techniques that were the mainstay of the industry for so many years. The process of automation of component connection meant that the soldering process is fast and very reliable. In fact, it is one of the few industrial fabrication processes that could boast a near perfect record.
However, the main issue with the lead based soldering techniques was the damage to environment. This damage was done at every step of the fabrication and lifecycle of the device. In contrast, ACF Bonding uses synthetics that do not damage the environment and provide a safe alternative with performances that exceed the lead based soldering techniques.
Given the environmental dangers posed by lead and the high propensity of lead poisoning, the fabrication industry has phased out the material. The problem with led based solders is the fact that the damage caused by lead continues even after the devices have been ripped apart and recycled. Most of the lead solder is collected for later used but some escapes and find its way to ground water. This is why the connection techniques have more or less shifted to ACF bonding.
In the case of modern electronics, there are several components that are very sensitive to heat. Of such components, lead based soldering techniques could prove to be very disastrous. ACF Bonding operates at a lower temperature and thus is ideal for connecting components such as LCDs.